The creation of the transistor world’s thinnest with a thickness of only 3 atoms |

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According to a report recently published in the scientific reputation of Nature, the researchers have successfully developed a semiconductor manufacturing process with ultra-slim size of 3 atoms. This is a device made ​​up of transition metal materials dichalcogenide ( TMD ) with the advantage of size is extremely thin, promises will be used to fabricate the membrane but solar cells, light detectors Light or semiconductors in the high-tech equipment. At the same time, this success promises to enhance the density of transistors per unit area, ensure the correctness of Moore’s Law into the future. In the past, scientists have noticed these interesting properties and promising position of TMD – extremely thin material, size usually just outside the atom. However, the use of TMD to manufacture semiconductors, micro sensors, while ensuring sustainable properties is extremely difficult job. And after research efforts, successfully this time promises to soon become the manufacturing process TMD trade and dream about the IC, sensor size atomic ray of hope flashed a reality. Saien Xie, one of the members of the research team, said: “Our study of TMD has promoted the introduction of other related products in the micro-level. In principle, there is no barrier What makes a stop commercialization process this material. “ According to the report published in the journal Nature, this time the researchers have found a whole new way to produce outstanding properties TMD with Vietnam and especially stable than the previous method. Specifically, they used industrial technique called “chemical vapor deposition” (MOCVD). First, this process uses a mixture of two industrial compounds are used as alloys diethylsulfide now vahexacarbonyl. Then the mixture is mixed on a wafer of silicon and bring baked at 550 degrees C temperature within 26 hours in the presence of hydrogen. The end result is a £ 200 ultrathin transistor with excellent electrical properties and few errors. Only 2 out of 200, equivalent to 1% of the transistor is faulty. This is the process of producing the best TMD been done so far and absolutely can continue to develop textile commercialization.However, the next step, the scientists have to ensure that the process will create products with absolute consistency. Humberto Gutierrez, a physicist at the University of Louisville, who also is conducting research related to ultra-thin materials (not join this study) says “this report is a resource important to understand about this material, however, is still a lack of research a systematic way and the method further comprises not be used this time. Many previous studies have shown that non-MOCVD method be applied in a consistent manner between the different labs and many products also have relatively low crystal quality. “ If this research achievements continue to be implemented, it could be a revolution important for generation of electronic products in the future. Currently, manufacturers have nearly reached the limit density of semiconductor silico, from which some other reviews that Moore’s Law is about to end. If the electronic device itself is getting smaller and faster, we need a super-small materials may contain estimates of the thickness located inside the circuit while ensuring stability, not overheating leads to breaks cancel. Currently, it has been nominated for TMD and graphene as 2 instead of silicon materials which are widely used today. As mentioned above, TMD is often mentioned along with its brothers in the world ultrathin materials tech: graphene.Both are 2 types of materials can create ultra-thin product sizes and even a few atoms, the scientists are calling them ” two-dimensional materials . ” Use the links at the location, they may form one seamless layer only one atom thick. And if it is used to make chips, manufacturers can “cram” the number of semiconductor unprecedented in a microprocessor modern. In the immediate future, the team still had to continue resolving conflicts outstanding to enhance the feasibility of conducting commercialization. At the same time, they must find ways to produce TMD at lower temperatures in order to conform to the common electronic products due to numerous auxiliary materials can not withstand temperatures of 550 degrees C. If the settlement is all the backlog, this study can make a great revolution in the electronics industry in FT

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